241 |
P1012 |
single- and dual-core communications processors
|
298K |
|
|
242 |
P10-12R |
NON-INSULATED, 12-10 BARREL, RINGS
|
151K |
|
|
243 |
P10-12R-L |
NON-INSULATED, 12-10 BARREL, RINGS
|
151K |
|
|
244 |
P1014 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC
|
416K |
|
|
245 |
P1014 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC
|
416K |
|
|
246 |
P1014 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC
|
412K |
|
|
247 |
P1014 |
P1010 and P1014 low-power communications processors
|
239K |
|
|
248 |
P1014 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC
|
412K |
|
|
249 |
P10149EJ7V0IF00 |
Micro-X(84.84A.84B.84C.84D) Packages and Mold(38.S01) Packages (HJ-FET & GaAs MES FET) Taping Specification
|
95K |
|
|
250 |
P10-14R |
NON-INSULATED, 12-10 BARREL, RINGS
|
151K |
|
|
251 |
P10-14R-D |
NON-INSULATED, 12-10 BARREL, RINGS
|
151K |
|
|
252 |
P10-14R-L |
NON-INSULATED, 12-10 BARREL, RINGS
|
151K |
|
|
253 |
P1015 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC
|
412K |
|
|
254 |
P1015 |
TOSHIBA PHOTOINTERRUPTER INFRARED LED+PHOTO IC
|
412K |
|
|
255 |
P101G |
Optoelectronic
|
569K |
|
|
256 |
P101K |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
87K |
|
|
257 |
P101KW |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
258 |
P101KW |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
259 |
P101R |
Optoelectronic
|
569K |
|
|
260 |
P101T |
Analog IC
|
63K |
|
|
261 |
P101W |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
262 |
P101W |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
263 |
P101Y |
Optoelectronic
|
569K |
|
|
264 |
P102 |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
265 |
P102 |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
266 |
P102 |
PASSIVATED ASSEMBLED CIRCUIT ELEMENTS
|
84K |
|
|
267 |
P102 |
Passivated Assembled Circuit Elements, 25 A
|
183K |
|
|
268 |
P1020 |
single- and dual-core communications processors
|
233K |
|
|
269 |
P102-03SC |
Low Skew Output Buffer
|
218K |
|
|
270 |
P102-03SCL |
Low Skew Output Buffer
|
218K |
|
|