| 序号 | 型号 | 描述 | 大小 | 厂家Logo | 下载 |
|---|
| 1 | SOT523 | SUGGESTED PAD LAYOUT | 192K |
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| 2 | SOT527-1 | Package outline | 12K |
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| 3 | SOT527-1 | Package outline | 12K |
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| 4 | SOT533 | SOT533 | 8K |
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| 5 | SOT545-3 | plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad | 16K |
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| 6 | SOT553 | SUGGESTED PAD LAYOUT | 192K |
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| 7 | SOT553 | SUGGESTED PAD LAYOUT | 413K |
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| 8 | SOT563 | SUGGESTED PAD LAYOUT | 192K |
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| 9 | SOT563 | SUGGESTED PAD LAYOUT | 413K |
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总页数：1 每页记录数：30 当前页数：1 首页 上一页 1 下一页 尾页
