601 |
87782-3007 |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76μm (30μ) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free
|
574K |
|
|
602 |
87782-3009 |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76μm (30μ) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type D Tray, Lead free
|
574K |
|
|
603 |
87783-0001 |
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244 Circuits
|
495K |
|
|
604 |
87783-0201 |
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits
|
495K |
|
|
605 |
87783-0202 |
0.60mm (.024) Pitch miniDIMM DDR Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits
|
495K |
|
|
606 |
87783-0301 |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244 Circuits
|
495K |
|
|
607 |
87786-0001 |
iCool? Low Profile VRM Connector
|
198K |
|
|
608 |
87786-1002 |
1.00mm (.039) Pitch iCool? Low Profile VRM, Vertical, Surface Mount, with Latches, with Beveled Metal Pins, Signal 20, Power 72, 0.76μm(30μ)Gold (Au) Plating
|
323K |
|
|
609 |
87786-1002 |
Low Profile VRM Connector
|
196K |
|
|
610 |
87786-1011 |
Low Profile VRM Connector
|
196K |
|
|
611 |
87786-1011 |
1.00mm (.039) Pitch iCool? Low Profile VRM, Vertical, Surface Mount, with Latches, with Beveled Metal Pins, Signal 24, Power 70, 0.76μm(30μ)Gold (Au) Plating
|
323K |
|
|
612 |
87787-0001 |
iCool? Low Profile VRM Connector
|
198K |
|
|
613 |
87787-1002 |
Low Profile VRM Connector
|
196K |
|
|
614 |
87787-1011 |
Low Profile VRM Connector
|
196K |
|
|
615 |
87787-1012 |
1.00mm (.039) Pitch iCool? Low Profile VRM Socket, VRM 11, Vertical, Through Hole, with Latches, with Beveled Metal Pins, Signal 24, Power 70
|
339K |
|
|
616 |
87791-0114 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
144K |
|
|
617 |
87791-0116 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
144K |
|
|
618 |
87791-0120 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
144K |
|
|
619 |
87792-1114 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
|
492K |
|
|
620 |
87792-1116 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
|
492K |
|
|
621 |
87792-1120 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
|
492K |
|
|
622 |
87792-2116 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
|
492K |
|
|
623 |
87792-2120 |
2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
|
492K |
|
|
624 |
87794-0001 |
2.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits
|
109K |
|
|
625 |
87794-0002 |
2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits
|
117K |
|
|
626 |
87797-0010 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
|
128K |
|
|
627 |
87797-0040 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54μm (100μ) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
|
200K |
|
|
628 |
87797-0602 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
|
267K |
|
|
629 |
87797-1200 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height
|
266K |
|
|
630 |
87797-1800 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
|
266K |
|
|