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601 87782-3007 0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76μm (30μ) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free 574K MOLEX1 1001523
602 87782-3009 0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76μm (30μ) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type D Tray, Lead free 574K MOLEX1 1001522
603 87783-0001 0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244 Circuits 495K MOLEX1 1001521
604 87783-0201 0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits 495K MOLEX1 1001520
605 87783-0202 0.60mm (.024) Pitch miniDIMM DDR Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits 495K MOLEX1 1001519
606 87783-0301 0.60mm (.024) Pitch miniDIMM DDR3 Socket, Surface Mount, 22.5° Angle, 0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244 Circuits 495K MOLEX1 1001518
607 87786-0001 iCool? Low Profile VRM Connector 198K MOLEX1 1001517
608 87786-1002 1.00mm (.039) Pitch iCool? Low Profile VRM, Vertical, Surface Mount, with Latches, with Beveled Metal Pins, Signal 20, Power 72, 0.76μm(30μ)Gold (Au) Plating 323K MOLEX1 1001515
609 87786-1002 Low Profile VRM Connector 196K MOLEX1 1001516
610 87786-1011 Low Profile VRM Connector 196K MOLEX1 1001513
611 87786-1011 1.00mm (.039) Pitch iCool? Low Profile VRM, Vertical, Surface Mount, with Latches, with Beveled Metal Pins, Signal 24, Power 70, 0.76μm(30μ)Gold (Au) Plating 323K MOLEX1 1001514
612 87787-0001 iCool? Low Profile VRM Connector 198K MOLEX1 1001512
613 87787-1002 Low Profile VRM Connector 196K MOLEX1 1001511
614 87787-1011 Low Profile VRM Connector 196K MOLEX1 1001510
615 87787-1012 1.00mm (.039) Pitch iCool? Low Profile VRM Socket, VRM 11, Vertical, Through Hole, with Latches, with Beveled Metal Pins, Signal 24, Power 70 339K MOLEX1 1001509
616 87791-0114 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free 144K MOLEX1 1001508
617 87791-0116 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free 144K MOLEX1 1001507
618 87791-0120 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free 144K MOLEX1 1001506
619 87792-1114 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap 492K MOLEX1 1001505
620 87792-1116 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging 492K MOLEX1 1001499
621 87792-1120 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging 492K MOLEX1 1001498
622 87792-2116 2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap 492K MOLEX1 1001497
623 87792-2120 2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap 492K MOLEX1 1001496
624 87794-0001 2.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits 109K MOLEX1 1001495
625 87794-0002 2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits 117K MOLEX1 1001494
626 87797-0010 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging 128K MOLEX1 1001493
627 87797-0040 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54μm (100μ) Tin (Sn) Plating, 14.22mm (.560) Stacking Height 200K MOLEX1 1001492
628 87797-0602 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, 25.60mm (1.043) Stacking Height 267K MOLEX1 1001491
629 87797-1200 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height 266K MOLEX1 1001490
630 87797-1800 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging 266K MOLEX1 1001489