当前位置:PDF资料网 » 型号搜索 » 搜索关键字:705
序号 型号 描述 大小 厂家Logo 下载
511 70563-0052 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, Tin (Sn) Plating 230K MOLEX1 1033417
512 70563-0053 2.54mm (.100 230K MOLEX1 1033416
513 705-63-0057 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 23 Circuits, Tin (Sn) Plating 230K MOLEX1 1033415
514 70563-0108 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 4Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033420
515 70563-0110 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 6Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033419
516 70563-0112 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033414
517 70563-0113 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 9Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033413
518 70563-0114 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033412
519 705-63-0115 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 11 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033411
520 70563-0116 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033410
521 70563-0117 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 13 Circuits, 0.76um (30u") 230K MOLEX1 1033409
522 70563-0118 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 14 Circuits, 0.76um 230K MOLEX1 1033408
523 705-63-0120 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033407
524 70563-0122 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033406
525 70563-0123 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 19Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033405
526 70563-0128 2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 24 Circuits, 0.76um (30u") 230K MOLEX1 1033404
527 70563-0129 2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 25Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 230K MOLEX1 1033403
528 70567-0001 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033402
529 705670002 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033401
530 70567-0003 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033400
531 705670004 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033399
532 705670005 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033398
533 705670006 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033378
534 70567-0007 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033377
535 70567-0008 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033376
536 70567-0009 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033397
537 70567-0010 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033396
538 70567-0011 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033395
539 70567-0012 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033394
540 70567-0013 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating 1259K MOLEX1 1033393