511 |
70563-0052 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, Tin (Sn) Plating
|
230K |
|
|
512 |
70563-0053 |
2.54mm (.100
|
230K |
|
|
513 |
705-63-0057 |
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 23 Circuits, Tin (Sn) Plating
|
230K |
|
|
514 |
70563-0108 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 4Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
515 |
70563-0110 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 6Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
516 |
70563-0112 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
517 |
70563-0113 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 9Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
518 |
70563-0114 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
519 |
705-63-0115 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 11 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
520 |
70563-0116 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
521 |
70563-0117 |
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 13 Circuits, 0.76um (30u")
|
230K |
|
|
522 |
70563-0118 |
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 14 Circuits, 0.76um
|
230K |
|
|
523 |
705-63-0120 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
524 |
70563-0122 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
525 |
70563-0123 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 19Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
526 |
70563-0128 |
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 24 Circuits, 0.76um (30u")
|
230K |
|
|
527 |
70563-0129 |
2.54mm (.100") Pitch SL? Header, Single Row, Vertical, .180" Pocket, Shrouded, 25Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
230K |
|
|
528 |
70567-0001 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
1259K |
|
|
529 |
705670002 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
|
1259K |
|
|
530 |
70567-0003 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
|
1259K |
|
|
531 |
705670004 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
|
1259K |
|
|
532 |
705670005 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
|
1259K |
|
|
533 |
705670006 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
|
1259K |
|
|
534 |
70567-0007 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
|
1259K |
|
|
535 |
70567-0008 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
1259K |
|
|
536 |
70567-0009 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
|
1259K |
|
|
537 |
70567-0010 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
|
1259K |
|
|
538 |
70567-0011 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
|
1259K |
|
|
539 |
70567-0012 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
|
1259K |
|
|
540 |
70567-0013 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
|
1259K |
|
|