| 1 |
7024.934 |
Fuse
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2648K |
|
 |
| 2 |
7024016PROCELL |
PROCELL BATTERY PP3 Inhalt pro Packung: 10 Stk.
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41K |
|
|
| 3 |
70243 |
2 mm Modular Interconnect System
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4540K |
|
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| 4 |
70246-0801 |
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
192K |
|
|
| 5 |
70246-0802 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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192K |
|
|
| 6 |
70246-1001 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 7 |
70246-1002 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 8 |
70246-1004 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 9 |
70246-1202 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 10 |
70246-1401 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 11 |
70246-1402 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 12 |
70246-1404 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating
|
192K |
|
|
| 13 |
70246-1601 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 14 |
70246-1602 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 15 |
70246-1604 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
|
192K |
|
|
| 16 |
70246-2001 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 17 |
70246-2002 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 18 |
70246-2004 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
|
192K |
|
|
| 19 |
70246-2401 |
2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au)
|
192K |
|
|
| 20 |
70246-2402 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 21 |
70246-2501 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void
|
192K |
|
|
| 22 |
70246-2601 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 23 |
70246-2602 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 24 |
70246-2604 |
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
|
192K |
|
|
| 25 |
70246-3001 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 26 |
70246-3002 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 27 |
70246-3004 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
|
192K |
|
|
| 28 |
70246-3401 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 29 |
70246-3402 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
192K |
|
|
| 30 |
70246-3404 |
2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
|
192K |
|
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