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8793 datasheet pdf 下载

序号 型号 描述 大小 厂家Logo 下载
1 87933-1007 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap 364K MOLEX1 87933-1007
2 87933-1211 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38μm (15μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap 364K MOLEX1 87933-1211
3 87933-1215 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap 364K MOLEX1 87933-1215
4 87933-1217 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76μm (30μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap 364K MOLEX1 87933-1217
5 87933-3015 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap 364K MOLEX1 87933-3015
6 87933-5031 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120) 179K MOLEX1 87933-5031
7 87937-0106 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height 105K MOLEX1 87937-0106
8 87937-0406 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height 105K MOLEX1 87937-0406
9 87937-0502 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50μm (100μ") Tin (Sn) Plating, 11.00mm (.433) Stacking Height 105K MOLEX1 87937-0502
10 87937-0600 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75μm (29μ) Gold (Au) Plating, 10.90mm (.429) Stacking Height 199K MOLEX1 87937-0600
11 87937-0800 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 12.00mm (.472) Stacking Height 199K MOLEX1 87937-0800
12 87937-0801 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75μm (29μ) Gold (Au) Plating, 10.90mm (.429) Stacking Height 199K MOLEX1 87937-0801
13 87937-0802 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height 105K MOLEX1 87937-0802
14 87937-1206 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height 105K MOLEX1 87937-1206
15 87937-1600 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25μm (10μ) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height 199K MOLEX1 87937-1600
16 87937-1601 2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25μm (10μ) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height 199K MOLEX1 87937-1601
17 87938-0002 2.54mm (.100) Pitch KK? Header, Surface Mount, Single Row Dual Body, Vertical, 8 Circuits, Gold (Au) Selective Plating, 8.07mm (.318) Stacking Height 167K MOLEX1 87938-0002
18 87939-0001 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 106K MOLEX1 87939-0001
19 87939-2000 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 15.35mm(.604) Stacking Height 341K MOLEX1 87939-2000
20 87939-4001 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 6.40mm(.251) 342K MOLEX1 87939-4001