| 序号 | 型号 | 描述 | 大小 | 厂家Logo | 下载 |
|---|
| 1 | 87797-1200 | 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height | 266K |
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深圳市碧威特网络技术有限公司
| 序号 | 型号 | 描述 | 大小 | 厂家Logo | 下载 |
|---|
| 1 | 87797-1200 | 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height | 266K |
|
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