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序号 型号 描述 大小 厂家Logo 下载
1 7024.934 Fuse 2648K 暂无图片 7024.934
2 7024016PROCELL PROCELL BATTERY PP3 Inhalt pro Packung: 10 Stk. 41K 暂无图片 7024016PROCELL
3 70243 2 mm Modular Interconnect System 4540K FCI-CONNECTOR 70243
4 70246-0801 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 192K MOLEX1 70246-0801
5 70246-0802 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-0802
6 70246-1001 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1001
7 70246-1002 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1002
8 70246-1004 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1004
9 70246-1202 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1202
10 70246-1401 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1401
11 70246-1402 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1402
12 70246-1404 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating 192K MOLEX1 70246-1404
13 70246-1601 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1601
14 70246-1602 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-1602
15 70246-1604 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-1604
16 70246-2001 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-2001
17 70246-2002 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-2002
18 70246-2004 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-2004
19 70246-2401 2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au) 192K MOLEX1 70246-2401
20 70246-2402 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-2402
21 70246-2501 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void 192K MOLEX1 70246-2501
22 70246-2601 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-2601
23 70246-2602 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-2602
24 70246-2604 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-2604
25 70246-3001 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-3001
26 70246-3002 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-3002
27 70246-3004 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-3004
28 70246-3401 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-3401
29 70246-3402 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-3402
30 70246-3404 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-3404
31 70246-4001 2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits 192K MOLEX1 70246-4001
32 70246-4002 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-4002
33 70246-4004 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-4004
34 70246-4401 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-4401
35 70246-4402 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-4402
36 70246-5001 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 50Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-5001
37 70246-5002 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 50Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-5002
38 70246-5004 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 50Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 192K MOLEX1 70246-5004
39 70246-6001 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 60Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-6001
40 70246-6002 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 60Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-6002
41 70246-6401 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 64Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-6401
42 70246-6402 2.54mm (.100") Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 64 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 192K MOLEX1 70246-6402
43 70247-0851 2.54mm (.100") Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 177K MOLEX1 70247-0851
44 70247-0852 2.54mm (.100") Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 177K MOLEX1 70247-0852
45 70247-0869 2.54mm (.100") Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, without 134K MOLEX1 70247-0869
46 70247-1051 2.54mm (.100") Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 177K MOLEX1 70247-1051
47 70247-1052 2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 10 Circuits, 0.76um 177K MOLEX1 70247-1052
48 70247-1054 2.54mm (.100") Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating 177K MOLEX1 70247-1054
49 70247-1251 2.54mm (.100") Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 177K MOLEX1 70247-1251
50 70247-1252 2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits 177K MOLEX1 70247-1252